Wet Processing Outerlayers

PCBequip Besoram

BESORAM PCB equipment trade to the PCB Industry

Wet Processing Outerlayers

IS Stripping - Ammonia Etching line 30"

ID# 122-123

International Suplies , dry film Stripping & ammonia Etching Line for Outher Layers max etch speed 2m/min for 40u copper, panel ticknes 0,15 to 10 mm .Stripmaster 30" Double Strip Chamber, Quad Rinse Cascade, & Exit and with Drum Filter System , Etchmaster 30" Ammonia Etching System Double Etch Chamber, Quad Rinse Cascade, & Exit total titanium build, feed & bleed system IS Tin bleecher ,Quad Rinse Cascade, SHD A-A dryer. Heating by hot water generator.

 

IS chemical copper cleaner outherlayers 30"

ID# 106

IS International Suplies chemical copper cleaner before outherlayers lamination, material tickness min 0.1 max 12 mm.

Transport width 800 mm, 5x cascade rinse - SHD A-A dryer for tick panel small holes drying.

Hot water heating.

 

CRH copper cleaner line

ID# 119

Chemical cleaning before dry film lamination, 3 x cascade rinse , micro etch , 3x cascade rinse and dryer.

 

 

IS Devmaster 30"

ID# 115

IS International Suplplies Devmaster SHD 30" double develop chamber, quad rinse cascade, SHD A-A dryer & exit.

Panel tickness 0.15 to 12mm, transport witdh 800 mm, developing speed 2 m/min.

Hot water heating

 

IS Developer

ID# 118

IS International Suplplies Developer double develop chamber, SHD dryer ,exit conveyor.

Panel tickness 0.2 to 5 mm, transport width 615 mm, speed 1,7 m /min.

Electrical heating.

 

IS Developer preparation system

ID# 122a & ID# 117

ID# 122a IS International Suplies praparation system with, distribution pump to different machines.

ID# 117 IS International Suplies preparation system.

IS Sn/Pb stripping machine 30"

ID# 126

IS International Suplies Sn/Pb Stripping Line max speed 2m/min, panel ticknes 0,15 to 10 mm

2x stripping module, 5 x cascade rinse, inspection zone, feed & bleed system.

transport width 800 mm. Hot water heating.

This machine can operate in line with ID# 127 IS Pumiflex 2000 , for copper threatment before put up soldermask.

IS Surface cleaner 30"

ID# 197

IS Surface Cleaning Machine after solder mask and before chemical Au - Sn or Ag .

Transport width 800 mm , panel ticknes 0.1 to 12 mm.

Input conveyor, spray cleaning , 3x cas rince , SHD A-A dryer, outlet conveyor.

Hot water heating.